RT/duroid 6010.2LM 2-Layer 75mil Immersion Silver PCB for High-Dk Microwave Applications
1.Introduction of RT/duroid 6010.2LM
RT/duroid 6010.2LM laminates are ceramic-PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6010.2LM laminates provide high dielectric constants (Dk) to enable circuit size reduction. These materials are low loss, ideal for operating at X-band or below. Additionally, their tight Dk and thickness control deliver repeatable circuit performance.
2.Key Features
High Dielectric Constant: 10.2 ±0.25 at 10GHz
Low Loss Performance: Dissipation factor of 0.0023 at 10GHz
High Temperature Resistance: Decomposition Temperature (Td) of 500°C TGA
Exceptional Environmental Resistance: Moisture Absorption of 0.01%
Thermal Stability: Coefficient of Thermal Expansion x/y/z: 24 ppm/°C, 24 ppm/°C, 47 ppm/°C
Effective Thermal Management: Thermal Conductivity of 0.86W/mk
Safety Certified: Flammability Rating of V-0 UL94
3.Benefits
Circuit Miniaturization: High dielectric constant for circuit size reduction
High Frequency Performance: Low loss, ideal for operating at X-band or below
Enhanced Reliability: Low Z-axis expansion, providing reliable plated through holes in multilayer boards
Environmental Stability: Low moisture absorption, reducing effects of moisture on electrical loss
Consistent Performance: Tight Dk and thickness control for repeatable circuit performance
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RT/duroid 6010.2LM |
| Layer Count | 2 Layers |
| Board Dimensions | 45.4mm × 31.8mm = 1PC, ±0.15mm |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 2.0mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Silver |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (12-Layer Rigid Structure)
Copper Layer 1 - 35 μm
Rogers RT/duroid 6010.2LM Core - 1.905 mm (75mil)
Copper Layer 2 - 35 μm
6.PCB Statistics:
Components: 15
Total Pads: 41
Thru Hole Pads: 25
Top SMT Pads: 16
Bottom SMT Pads: 0
Vias: 41
Nets: 2
7.Typical Applications
Patch Antennas
Satellite Communications Systems
Power Amplifiers
Aircraft Collision Avoidance Systems
Ground Radar Warning Systems
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
